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What Happens during Thermal Post-Treatment of Powder Aerosol Deposited Functional Ceramic Films? : Explanations Based on an Experiment-Enhanced Literature Survey

DOI zum Zitieren der Version auf EPub Bayreuth: https://doi.org/10.15495/EPub_UBT_00005062
URN to cite this document: urn:nbn:de:bvb:703-epub-5062-2

Title data

Exner, Jörg ; Nazarenus, Tobias ; Hanft, Dominik ; Kita, Jaroslaw ; Moos, Ralf:
What Happens during Thermal Post-Treatment of Powder Aerosol Deposited Functional Ceramic Films? : Explanations Based on an Experiment-Enhanced Literature Survey.
In: Advanced Materials. Vol. 32 (2020) Issue 19 . - No. 1908104.
ISSN 1521-4095
DOI der Verlagsversion: https://doi.org/10.1002/adma.201908104

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Project information

Project title:
Project's official titleProject's id
ForOXiE2AZ-1143-14
Aerosolbasierte Kaltabscheidung: Co-Deposition von Funktionsmaterialien und Füllstoffen zur Substitution einer nachfolgenden WärmebehandlungMO-1060/37-1

Project financing: Bayerische Forschungsstiftung
Deutsche Forschungsgemeinschaft

Abstract

Powder aerosol deposition (PAD) is a unique ceramic spray coating method that produces dense and well‐adhering thick‐films directly at room temperature, without requiring any heating or sintering. After the successful film formation, mechanical film properties like hardness or plasma resistance are remarkably good. However, when it comes to electrical properties like permittivity or electrical conductivity, the nanocrystalline structure of PAD films combined with high internal strains deteriorates partly the characteristic properties. The electrical conductivity may already be present within the as‐deposited films. However, it is mostly lowered by several orders of magnitude. Therefore, a thermal post‐deposition annealing is oftentimes required. In this work, electrically conducting films produced by powder aerosol deposition are surveyed based on published data. Their microstructural and electrical behavior during the post‐deposition annealing treatment is summarized and reasons for the lowered electrical conductivity are identified. Additionally, the processes taking place during annealing, which eventually allow to regain bulk‐like functional properties, are examined. A universal annealing behavior is found that leads to a quantitative recommendation for the suitable film annealing temperatures to regain the electrical conductivities.

Further data

Item Type: Article in a journal
Keywords: electrical conducting films; microstrain reduction; post-deposition annealing; required annealing temperature; room-temperature impact consolidation
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Institutions of the University: Faculties > Faculty of Engineering Science > Chair Functional Materials > Chair Functional Materials - Univ.-Prof. Dr.-Ing. Ralf Moos
Profile Fields > Advanced Fields
Research Institutions > Research Centres > Bayreuth Center for Material Science and Engineering - BayMAT
Faculties
Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Functional Materials
Profile Fields
Research Institutions
Research Institutions > Research Centres
Language: German
Originates at UBT: Yes
URN: urn:nbn:de:bvb:703-epub-5062-2
Date Deposited: 16 Sep 2020 06:53
Last Modified: 16 Sep 2020 06:54
URI: https://epub.uni-bayreuth.de/id/eprint/5062

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